LI-900 Rigid Tile

Name: LI-900 Rigid Tile
Database: NASA Ames Thermal Protection Materials
Category: Silicon-Based Reusable Composites: Rigid Ceramic Tiles
Composition: 100% SiO2
Manufacturer: United Space Alliance (USA)
Technical Readiness Level: 9
Last Modified: 2001-10-01

Description:

  • LI-900 is a relatively low density (~9 lbs/cu.ft.) and very low thermal conductivity fibrous insulation material baselined for use on all the shuttle orbiters. It is the primary tile insulation flying almost everywhere on all of the orbiters due to its thermal conductivity, thermal shock resistance and efficiency as a TPS.

Point of Contact:

  • Daniel Leiser
  • NASA Ames Research Center
  • dleiser@mail.arc.nasa.gov

Pictures:

Properties at Standard Conditions
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Property Value Units Uncertainty Source STP Reference Last Modified Additional Data
Density1 9.00e+00 lbm/ft^3 1.32e-01 measured interpolated(T) 1 2006-01-05
Thermal Conductivity (Thru-the-Thickness)2 7.64e-06 Btu/ft-s-R 1.38e-06 measured TRUE 4 2006-01-05
Thermal Conductivity (In-Plane)3 1.08e-05 Btu/ft-s-R 1.96e-06 measured TRUE 4 2006-01-05
Specific Heat4 1.50e-01 Btu/lbm-R 2.01e-02 measured TRUE 4 2006-01-05
Emissivity5 8.80e-01 - 4.40e-02 measured TRUE 3 2006-01-05
Multiple Use Temperature Limit6 2.86e+03 R 1.43e+02 predicted assumed/assumed 5 2006-01-05
Single Use Temperature Limit7 3.16e+03 R 1.58e+02 predicted assumed/assumed 5 2006-01-05
Tensile Strength (Thru-the-Thickness)8 3.46e+03 psf 7.10e+02 measured assumed/assumed 6 2006-01-05
Tensile Strength (In-Plane)9 9.79e+03 psf 1.44e+03 measured assumed/assumed 6 2006-01-05
Tensile Modulus (Thru-the-Thickness)10 1.01e+06 psf 5.03e+04 measured assumed/assumed 6 2006-01-05
Tensile Modulus (In-Plane)11 3.60e+06 psf 1.80e+05 measured assumed/assumed 6 2006-01-05
Compressive Strength (Thru-the-Thickness)12 4.03e+03 psf 2.02e+02 measured assumed/assumed 6 2006-01-05
Compressive Strength (In-Plane)13 1.01e+04 psf 5.03e+02 measured assumed/assumed 6 2006-01-05
Coefficient of Thermal Expansion (Isotropic)14 2.25e-07 1/R 2.70e-08 measured TRUE 6 2006-01-05
Dielectric Constant15 1.13 - 5.65e-03 measured nonstp 6 2006-01-05
Loss Tangent16 4.00e-04 - 2.00e-05 measured nonstp 6 2006-01-05
Purchase Cost17 1.16e+03 $/ft^2 5.80e+01 predicted assumed/assumed 2 2006-01-05
Installation Time18 3.28e+05 s/ft^2 1.64e+04 predicted assumed/assumed 2 2006-01-05
Inspection/Repair Time per Flight19 7.56e+03 s/ft^2 3.78e+02 predicted assumed/assumed 2 2006-01-05
Replacement Fraction per Flight20 2.50e-03 - 1.25e-04 predicted assumed/assumed 2 2006-01-05
Reuse Flight Limit (# of flights)21 1.00e+02 - 5.0 predicted assumed/assumed 2 2006-01-05

Notes:

  • 1. Value is for uncoated tile.
  • 2. Dynamic values for transient environments. Uncertainty (tolerance) is +/- 18% or +/- 5.8e-3 W/mK (0.04 BTU-in/ft2-hr-F), whichever is greater
  • 3. Dynamic values for transient environments.
  • 4. Uncertainty (tolerance) is +/- 10% or +/- 4.8e-6 W/mK (0.02 BTU/lb-F), whichever is greater
  • 5. Value is for uncoated tile. Room temperature value is measured. The higher temperature values are extrapolated.
  • 6. Predicted based on arcjet and/or shuttle flight test data. The material softens above 1644K (2500F) and melts at about 1978K (3100F).
  • 7. Predicted based on arcjet and/or shuttle flight test data. The material softens above 1644K (2500F) and melts at about 1978K (3100F).
  • 8. Mechanical properties remain relatively constant up to 1144K (1600F), where a gradual reduction in strength begins. Standard deviation value based on approximately 2000 room-temperature tests.
  • 9. Mechanical properties remain relatively constant up to 1144K (1600F), where a gradual reduction in strength begins. Standard deviation value based on approximately 2000 room-temperature tests.
  • 10. Only room temperature values are available from the reference.
  • 11. Only room temperature values are available from the reference.
  • 12. Only room temperature values are available from the reference.
  • 13. Only room temperature values are available from the reference.
  • 14. Uncertainty (tolerance) is +/- 12% or the measurement limit, whichever is greater. Directional dependence not specified, so isotropic is assumed.
  • 15. RF characteristics at 10GHz (room temperature)
  • 16. RF characteristics at 10GHz (room temperature)
  • 17. Cost for RCG coated tile. Predicted based on arcjet and/or shuttle flight test data.
  • 18. Predicted based on arcjet and/or shuttle flight test data.
  • 19. Predicted based on arcjet and/or shuttle flight test data.
  • 20. Predicted based on arcjet and/or shuttle flight test data.
  • 21. Predicted based on arcjet and/or shuttle flight test data.

Property References:

  • 1. S. Amanda Chiu, William C. Pitts: Reusable Surface Insulations for Reentry Spacecraft:AIAA Paper 91-0695:Jan. 1991:TPSX Ref. #3.
  • 2. D.J. Rasky: Thermal Protection Systems for Future Reusable Launch Vehicles:25th International Conference on Environmemtal Systems, No. 951618:Jul. 1995:TPSX Ref. #7.
  • 3. J. Ridge, J. Marschall: Estimation of Temperature Dependent Emissivities from Room Temperature Spectral Reflectance Measurements on Coated and Uncoated TPS Tiles:ELORET/Thermosciences Institute Report TSI-STM01-96-01:Sep. 1996:TPSX Ref. #10.
  • 4. anon: Space Shuttle Program Thermodynamic Design Data Book. Penetrations.:SD73-SH-0226:Rockwell International, Downey, CA:Jan. 1981:TPSX Ref. #23.
  • 5. anon: Shuttle Operational Data Book:Boeing Document:Boeing:TPSX Ref. #28.
  • 6. anon: LI-900: Lockheed's All-Silica Insulation Material:Lockheed Missiles and Space Co.:Apr-83:TPSX Ref. #132.

General References:

  • 1. D.A. Stewart, D.B. Leiser: Characterization of the Thermal Conductivity for Fibrous Refractory Composite Insulations:Ceramic Engineering and Science Proceedings:1985:TPSX Ref. #1.
  • 2. D.A. Stewart, D.B. Leiser: Characterization of the Thermal Conductivity for Advanced Toughened Uni-Piece Fibrous Insulations:AIAA Paper 93-2755:AIAA:Jul. 1993:TPSX Ref. #2.
  • 3. S. Amanda Chiu, William C. Pitts: Reusable Surface Insulations for Reentry Spacecraft:AIAA Paper 91-0695:Jan. 1991:TPSX Ref. #3.
  • 4. D.B. Leiser, M. Smith, D.A. Stewart, H.E. Goldstein: Thermal and Mechanical Properties of Advanced High Temperature Ceramic-Composite Insulation:Ceram. Eng. Sci. Proc.:1983:TPSX Ref. #4.
  • 5. Smith, J.A., and Curry, D.M: Aeroassist Flight Experiment Aerobrake Thermal Design Data Book:NASA JSC-23571:NASA JSC, Houston, TX:May-89:TPSX Ref. #5.
  • 6. R.M. Beasley, Y.D. Izu, et al.: Fabrication and Improvement of LMSC's All-Silica RSI:Tech. Report No. NASA TMX-2719:Nov. 1972:TPSX Ref. #6.
  • 7. D.J. Rasky: Thermal Protection Systems for Future Reusable Launch Vehicles:25th International Conference on Environmemtal Systems, No. 951618:Jul. 1995:TPSX Ref. #7.
  • 8. C. Ehrlich, et al.: Advanced Manned Launch System Study (AMLS); Reusable Cyrogenic Tank Design:Contract NAS1-18975 DRD-9:Rockwell International, Space Systems Division, Downey, CA:Jul.-Sep. 1993:TPSX Ref. #8.
  • 9. anon: Current Technology for Thermal Protection Systems:NASA Conf. Pub. 3157:Feb. 1992:TPSX Ref. #9.
  • 10. J. Ridge, J. Marschall: Estimation of Temperature Dependent Emissivities from Room Temperature Spectral Reflectance Measurements on Coated and Uncoated TPS Tiles:ELORET/Thermosciences Institute Report TSI-STM01-96-01:Sep. 1996:TPSX Ref. #10.