AETB-8 Rigid Tile

Name: AETB-8 Rigid Tile
Database: NASA Ames Thermal Protection Materials
Category: Silicon-Based Reusable Composites: Rigid Ceramic Tiles
Composition: 20% AL2O3, 12% (14% B2O3, 72% AL2O3, 14% SiO2-Nextel), 68% SiO2
Manufacturer: Boeing, Forrest Machining, United Space Alliance (USA)
Technical Readiness Level: 8
Last Modified: 2001-10-01

Description:

  • AETB-8 is a low density (~8 lbs/cu.ft.), low thermal conductivity fibrous insulation material with higher temperature capability and better processing dimensional stability than the FRCI-12, LI-900 and LI-2200 insulation that are baselined on all of the shuttle orbiters. It is currently flying very successfully on the shuttle in the base heatshield with significantly improved performance relative to the original LI-900.

Point of Contact:

  • Daniel Leiser
  • NASA Ames Research Center
  • dleiser@mail.arc.nasa.gov

Pictures:

Properties at Standard Conditions
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Property Value Units Uncertainty Source STP Reference Last Modified Additional Data
Density1 1.28e+02 kg/m^3 6.41 measured assumed/assumed 1 2006-01-05
Thermal Conductivity (Thru-the-Thickness)2 6.84e-02 W/m-K 3.42e-03 predicted TRUE 5 2006-01-05
Specific Heat3 6.28e+02 J/kg-K 31.4 predicted TRUE 2 2006-01-05
Emissivity4 8.99e-01 - 4.49e-02 measured TRUE 4 2006-01-05
Multiple Use Temperature Limit 1.64e+03 K 82.2 predicted assumed/assumed 1 2006-01-05
Single Use Temperature Limit 1.81e+03 K 90.6 predicted assumed/assumed 1 2006-01-05
Tensile Strength (Thru-the-Thickness) 3.79e+05 Pa 1.90e+04 measured assumed/assumed 1 2006-01-05
Tensile Strength (In-Plane) 6.89e+05 Pa 3.45e+04 measured assumed/assumed 1 2006-01-05
Tensile Modulus (Thru-the-Thickness) 6.21e+07 Pa 3.10e+06 measured assumed/assumed 1 2006-01-05
Tensile Modulus (In-Plane) 1.52e+08 Pa 7.58e+06 measured assumed/assumed 1 2006-01-05
Purchase Cost5 1.25e+04 $/m^2 6.24e+02 predicted assumed/assumed 3 2006-01-05
Installation Time6 8.53e+05 s/m^2 4.26e+04 predicted assumed/assumed 3 2006-01-05
Inspection/Repair Time per Flight7 2.48e+04 s/m^2 1.24e+03 predicted assumed/assumed 3 2006-01-05
Replacement Fraction per Flight8 1.40e-03 - 7.00e-05 predicted assumed/assumed 3 2006-01-05
Reuse Flight Limit (# of flights)9 1.00e+02 - 5.0 predicted assumed/assumed 3 2006-01-05

Notes:

  • 1. Value is for uncoated tile.
  • 2. Dynamic values for transient environments. Thermal Conductivity calculated using a curve fit to experimentally measured values. Data extrapolated above 1533K (2300F).
  • 3. Values based on data for LI-2200 and FRCI-12.
  • 4. Value is for uncoated tile. Room temperature value is measured. The higher temperature values are extrapolated
  • 5. Cost for TUFI coated tile. Predicted based on arcjet and or flight test data.
  • 6. Predicted based on arcjet and or flight test data.
  • 7. Predicted based on arcjet and or flight test data.
  • 8. Predicted based on arcjet and or flight test data.
  • 9. Predicted based on arcjet and or flight test data.

Property References:

  • 1. S. Amanda Chiu, William C. Pitts: Reusable Surface Insulations for Reentry Spacecraft:AIAA Paper 91-0695:Jan. 1991:TPSX Ref. #3.
  • 2. Smith, J.A., and Curry, D.M: Aeroassist Flight Experiment Aerobrake Thermal Design Data Book:NASA JSC-23571:NASA JSC, Houston, TX:May-89:TPSX Ref. #5.
  • 3. D.J. Rasky: Thermal Protection Systems for Future Reusable Launch Vehicles:25th International Conference on Environmemtal Systems, No. 951618:Jul. 1995:TPSX Ref. #7.
  • 4. J. Ridge, J. Marschall: Estimation of Temperature Dependent Emissivities from Room Temperature Spectral Reflectance Measurements on Coated and Uncoated TPS Tiles:ELORET/Thermosciences Institute Report TSI-STM01-96-01:Sep. 1996:TPSX Ref. #10.
  • 5. anon: JSC Data, Orbiter Certification (Ref. ES4-97-002), AETB-8-July-97(cert):TPSX Ref. #141.

General References:

  • 1. D.A. Stewart, D.B. Leiser: Characterization of the Thermal Conductivity for Fibrous Refractory Composite Insulations:Ceramic Engineering and Science Proceedings:1985:TPSX Ref. #1.
  • 2. D.A. Stewart, D.B. Leiser: Characterization of the Thermal Conductivity for Advanced Toughened Uni-Piece Fibrous Insulations:AIAA Paper 93-2755:AIAA:Jul. 1993:TPSX Ref. #2.
  • 3. S. Amanda Chiu, William C. Pitts: Reusable Surface Insulations for Reentry Spacecraft:AIAA Paper 91-0695:Jan. 1991:TPSX Ref. #3.
  • 4. D.B. Leiser, M. Smith, D.A. Stewart, H.E. Goldstein: Thermal and Mechanical Properties of Advanced High Temperature Ceramic-Composite Insulation:Ceram. Eng. Sci. Proc.:1983:TPSX Ref. #4.
  • 5. Smith, J.A., and Curry, D.M: Aeroassist Flight Experiment Aerobrake Thermal Design Data Book:NASA JSC-23571:NASA JSC, Houston, TX:May-89:TPSX Ref. #5.
  • 6. D.J. Rasky: Thermal Protection Systems for Future Reusable Launch Vehicles:25th International Conference on Environmemtal Systems, No. 951618:Jul. 1995:TPSX Ref. #7.
  • 7. C. Ehrlich, et al.: Advanced Manned Launch System Study (AMLS); Reusable Cyrogenic Tank Design:Contract NAS1-18975 DRD-9:Rockwell International, Space Systems Division, Downey, CA:Jul.-Sep. 1993:TPSX Ref. #8.
  • 8. anon: Current Technology for Thermal Protection Systems:NASA Conf. Pub. 3157:Feb. 1992:TPSX Ref. #9.
  • 9. J. Ridge, J. Marschall: Estimation of Temperature Dependent Emissivities from Room Temperature Spectral Reflectance Measurements on Coated and Uncoated TPS Tiles:ELORET/Thermosciences Institute Report TSI-STM01-96-01:Sep. 1996:TPSX Ref. #10.
  • 10. D.B. Leiser, M. Smith, D.A. Stewart: Options for Improving Rigidized Ceramic Heatshields:Ceram. Eng. Sci. Proc.:1985:TPSX Ref. #14.
  • 11. M. Smith, D.B. Leiser, H.E. Goldstein: Alumina Enhanced Thermal Barrier:NASA Tech Brief:1989:TPSX Ref. #15.