4,4'-Oxydiphthalic anhydride (ODPA) + 3,4'-Oxydianiline:Para-phenylene diamine (3,4'-ODA:p-PDA)

Name: 4,4'-Oxydiphthalic anhydride (ODPA) + 3,4'-Oxydianiline:Para-phenylene diamine (3,4'-ODA:p-PDA)
Database: NASA Langley Research Center Database
Category: Polyamides
Composition: N/A
Manufacturer: 4,4'-Oxydiphthalic anhydride (ODPA) and Hydroquinone diether dianhydride (HQDEA) - Occidental Chemical Corporation
Technical Readiness Level: N/A
Last Modified: 2003-07-25

Description:

  • This material is a polyimide copolymer which was developed as part of an effort to find materials which are useful for microelectronics applications such as encapsulants, interlayer dielectrics, and stress relief layers. The poly(amide acid) (PAA) was prepared by the addition of different stoichiometric amounts of the dianhydride in powder form to a mechanically stirred solution of the diamine in DMAc under a nitrogen atmosphere at room temperature.

Point of Contact:

  • Catherine Fay
  • NASA Langley Research Center
  • c.c.fay@larc.nasa.gov

Pictures:

  • N/A

Properties at Standard Conditions
SI Units (MKS)
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Property Value Units Uncertainty Source STP Reference Last Modified Additional Data
Tensile Strength (Isotropic)1 2.07e+08 Pa 1.04e+06 measured nonstp* 1 2006-01-05
Tensile Modulus (Isotropic)2 5.72e+09 Pa 2.86e+07 measured nonstp* 1 2006-01-05
Coefficient of Thermal Expansion (Isotropic)3 9.50e-08 1/K 4.75e-10 measured nonstp* 1 2006-01-05

Notes:

  • 1. Measured using a SINTECH 2000-2 Computer Integrated Testing system, as recommended by ASTM-D882, at ambient temperature and humidity. At least five specimens were used. Other Value is Ratio of dianhydride to diamine.
  • 2. Measured using a SINTECH 2000-2 Computer Integrated Testing system, as recommended by ASTM-D882, at ambient temperature and humidity. At least five specimens were used. Other Value is Ratio of dianhydride to diamine.
  • 3. Obtained on a Seiko TMA Model 100 at a heating rate of 2 degrees C/min. Other Value is Ratio of dianhydride to diamine.

Property References:

  • 1. Catharine C. Fay, Anne K. St. Clair: Dimensionally Stable Polyimide Copolymers for Microelectronics Applications:TPSX Ref. #168.

General References:

  • 1. Catharine C. Fay, Anne K. St. Clair: Dimensionally Stable Polyimide Copolymers for Microelectronics Applications:TPSX Ref. #168.